Infineon signs wafer deal. Infineon stock trades 0.33 percent below its Xetra close of EUR 48.67
Published on 10/24/2026 at 10:32 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWSWafer agreement and trading levels
- Infineon and Wolfspeed signed a multi-year 200-millimeter wafer agreement on October 15, 2026.
- Infineon stock trades in weekend trading at EUR 48.51 at 10:29 a.m. CEST on October 24, 2026, 0.33 percent below the Xetra close of October 23, 2026.
- The next Xetra session falls on October 26, 2026.
Infineon Technologies AG signed a multi-year agreement with Wolfspeed for 200-millimeter silicon carbide wafers on October 15, 2026, according to the company's release. Infineon said the agreement supports its transition from 150-millimeter to 200-millimeter silicon carbide manufacturing.
Weekend trading
At 10:29 a.m. CEST on October 24, 2026, the Infineon share traded at EUR 48.51 in weekend trading at Lang & Schwarz. That was EUR 0.16, or 0.33 percent, below the Xetra close of October 23, 2026, at EUR 48.67. The bid was EUR 48.28 and the ask was EUR 48.74. The further course of weekend trading at Lang & Schwarz until 1:00 p.m. CET/CEST is shown by the continuously updated real-time quote of Infineon stock.
Silicon carbide supply
The agreement is intended to strengthen Infineon's substrate sourcing and supply-chain flexibility. The release said silicon carbide demand is linked to electric vehicles, renewable-energy systems and artificial-intelligence data-center power infrastructure. It also said Infineon operates a 200-millimeter silicon carbide fab in Kulim, Malaysia. These details were provided by Infineon.
Next Xetra session
The next Xetra session falls on October 26, 2026. Infineon is listed on the Frankfurt Stock Exchange under ticker IFX, according to the company's release. Infineon's latest technology announcement also described a 27-kilowatt three-phase power supply solution for AI server architectures, with peak efficiency above 98 percent at 480 volts AC and 50 percent load, in an October 8 technology release.
