Hanmi Semiconductor stock expands US support for AI packaging
Published on 11/06/2026 at 01:58 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWSUS expansion targets AI packaging
- Hanmi USA is designed to support North American customers as new packaging fabs come online.
- The company is broadening its equipment portfolio beyond memory stacking into 2.5D and flip-chip packaging.
- Direct engineering coverage could strengthen Hanmi's position against established equipment suppliers in the US market.
Hanmi Semiconductor established Hanmi USA in San Jose on October 20, creating a US base for field engineering and customer support in advanced semiconductor packaging. The company invested 1.5 million US dollars for a 100 percent stake in the California subsidiary, according to East Asia Brief.
San Jose hub supports US fabs
Hanmi says the office will act as an operational hub for engineers serving North American customers. The expansion follows Hanmi's existing bases in Taiwan, China and Singapore and is aimed at supporting new US semiconductor facilities as they move toward production.
The company supplies thermo-compression bonders that stack memory dies with heat and pressure, as well as micro saw and vision-placement systems. Its portfolio also includes 2.5D packaging bonders and flip-chip bonders, giving Hanmi an entry point into packaging work beyond its established memory business.
HBM demand drives equipment strategy
Hanmi's US push is tied to the expansion of high-bandwidth memory and advanced packaging for artificial-intelligence systems. East Asia Brief reported that Micron awarded Hanmi a 22.6 billion Korean won contract for Dual TC Bonder Tiger equipment and that Micron and SK hynix are planning additional US packaging capacity.
That demand creates an opportunity for Hanmi to deepen customer relationships through local installation and maintenance support. It also raises execution requirements: packaging tools must be calibrated and integrated as fabs ramp, while customer investment schedules can affect the timing of equipment orders.
Business model and competitive field
Hanmi Semiconductor is a South Korean semiconductor-equipment maker headquartered in Incheon. It develops and supplies bonding, wafer-sawing, inspection and placement equipment for memory and advanced-packaging applications, serving international chip manufacturers and packaging customers.
In thermo-compression bonding, Hanmi competes with Singapore-based ASMPT and Japan-based Tokyo Electron. Hanmi is more specialized in HBM bonding and related packaging tools, while those larger equipment groups offer broader semiconductor-manufacturing portfolios and established global support networks.
Hanmi Semiconductor at a glance
- Company: Hanmi Semiconductor Co., Ltd.
- ISIN: KR7042700005
- Ticker: 042700.KS
- Head office: Incheon, South Korea
- Focus: Semiconductor bonding, wafer sawing, inspection and advanced packaging equipment
South Korean semiconductor shares trade in the broader context of the KOSPI.
