Inari stock targets photonics and advanced packaging growth
Published on 11/01/2026 at 00:19 | Editorial responsibility: Rafael Müller, Editor-in-Chief AD HOC NEWSPhotonics Drive Inari's Next Phase
- Inari is expanding photonics and advanced semiconductor packaging for artificial-intelligence infrastructure and data-centre connectivity.
- The company plans additional equipment and facilities at its Penang P34 site during FY2027.
- Inari is also developing power-management products for AI data-centre cards, with a more meaningful earnings contribution expected from FY2028.
Inari Amertron is expanding its photonics and advanced semiconductor packaging capabilities as demand for artificial-intelligence infrastructure and data-centre connectivity grows. The strategy was outlined by chairman Datuk Phang Ah Tong in the company's FY2026 annual report, according to The Star on Monday, October 26, 2026.
AI Infrastructure Broadens Growth Pipeline
Inari has developed laser and photonics manufacturing capabilities for more than a decade. Its activities span wafer certification, chip fabrication, chip-on-carrier assembly, optical sub-assembly and related testing, giving the group exposure to several stages of the optical connectivity chain.
The company is expanding its photonics infrastructure at the P34 facility in Penang, with additional equipment and facilities planned for FY2027. Management also expects higher revenue contribution from photonics and advanced packaging alongside established radio-frequency and industrial products.
Advanced packaging is another strategic priority. Inari is working on capabilities including flip-chip attachment, substrate handling, underfill, moulding, thermal control, redistribution layers, copper-pillar bumping, fine-pitch interconnect, interposer assembly and 2.5D-related packaging.
New Products Could Take Time
Inari has begun a pilot production line for power-management products used in AI data-centre cards, including DC-DC converters and voltage regulators. The company expects a more meaningful earnings contribution from this activity from FY2028, leaving execution and customer adoption as important milestones for investors.
Company and Competitive Position
Inari Amertron provides outsourced semiconductor manufacturing services and produces radio-frequency, photonics, industrial and advanced-packaging solutions. It operates 11 manufacturing plants across Malaysia, the Philippines and China, covering more than 2.15 million square feet of manufacturing space. Its Malaysian peer set includes SkyeChip and Mi Technovation, while Inari is broadening its offering beyond established RF system-in-package work into photonics, connectivity and AI-related applications.
Inari Amertron at a Glance
- Company: Inari Amertron Berhad
- ISIN: MYQ0166OO007
- Business: Outsourced semiconductor manufacturing, RF products, photonics and advanced packaging
- Manufacturing footprint: 11 plants across Malaysia, the Philippines and China
- FY2027 focus: Photonics, advanced packaging and AI-related applications
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