Infineon Arms Europe's Robotics Start-ups While Building the Power Backbone for AI Data Centers
Published on 10/27/2026 at 16:30 | Editorial boerse-global.de
Infineon Technologies has paired a fresh start-up programme with a deepening hardware push, launching the Physical AI Growth Lab on Thursday alongside UnternehmerTUM Accelerator, Microsoft and NVIDIA. The equity-free support scheme is aimed at European ventures working in physical AI, robotics and industrial AI, and runs from January through April 2027. Investors took the news in stride: the shares were up 2.2% on the day.
The Munich chipmaker's week has been crowded with technology announcements, and the common thread running through most of them is electricity — specifically, how to deliver it efficiently to artificial intelligence workloads. On 21 October the company widened its collaboration with NVIDIA on power supply for AI data centers, with GaN-based conversion systems built for 800-volt direct-current architectures at the centre of the effort. A high-voltage intermediate circuit converter forms the technical core of that work.
Infineon also unveiled a high-voltage reference design for power distribution inside AI data centers. The board lets customers evaluate supply systems running at ±400 V and 800 V, giving them a way to test architectures before committing to production.
Enphase Deal Extends the Data Center Push
The announced cooperation with Enphase Energy points at the same end market. Infineon intends to supply monolithic bidirectional GaN switches rated at 900 volts, which will be folded into the development of Enphase's IQ-SST products. The components are destined for power modules used in solid-state transformers.
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Manufacturing capacity is being scaled to match. Infineon has earmarked roughly EUR 1.1 billion for expanding GaN production in Villach through 2034, where it plans to establish what it describes as the world's first high-volume fabrication of GaN power semiconductors on 300-millimeter wafers. Output is scheduled to begin at the end of 2027, and EUR 319 million in funding is expected to flow under the EU Chips Act. According to Reuters, the production is intended for data centers. Infineon says the site will serve demand from AI data centers, energy infrastructure, electromobility and robotics.
On the silicon carbide side, a multi-year supply agreement signed with Wolfspeed on 15 October covers 200-millimeter wafers and is designed to support the industry's shift from 150-millimeter to 200-millimeter production.
Under the Hood of Software-Defined Vehicles
Away from the server rack, Infineon brought its LinearFET MOSFET technology to market, targeting semiconductor-based power distribution systems in electric and software-defined vehicles. A separate high-voltage reference design for battery management pairs the AURIX TC4x microcontroller with a parallel processing unit, allowing battery models to run directly on the battery management unit.
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Further technology news from the company included ENDOPACK chip embedding for traction inverters and expanded OptiMOS-7 automotive MOSFETs. Infineon has also promised solutions and semiconductor innovations spanning physical AI, robotics, mobility and AI power supply at electronica, which runs from 10 to 13 November in Munich.
That trade show sits just ahead of the next scheduled disclosure of hard numbers. Infineon will report fourth-quarter and full-year 2026 results on 10 November.
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